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ST and Soitec cooperation will lead to backside-illumination (BSI) product manufacturing for mobile consumer markets
May 14, 2009
By: DAVID SAVASTANO
Editor, Ink World Magazine
STMicroelectronics and Soitecannounced an exclusive joint cooperation between the two companies that will lead to the development of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products. The resolution of today’s leading-edge image sensors is continuously increasing, while demand is high for the overall reduction of the camera-module footprint, particularly in consumer markets. This means the necessary development of smaller individua...
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